Copper Electroless GFC 124

فایل پیوست 18407

Electroless is a process in which a metallic layer is deposited by a reduction agent without an external electric current on a dielectric surface during a chemical reaction

The deposition in Electroless has higher hardness, higher corrosion and erosion resistance than the deposition in electroplating.

There are several kinds of Electroless solution such as copper, nickel, gold, tin, silver and platinum. From these solutions, copper and nickel are more common. In PCB industrial (Printed-Circuit-Board), for metallization of the boards and preparing them for PTH (Plating-Through-Hole), copper Electroless is preferred to nickel because of higher conductivity of copper than nickel.

This paper reports a study on production of copper Electroless. The effect of pH on copper concentration, rate of deposition ...

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